DocumentCode
3133498
Title
CAD formulas of microstrip line with perforated ground plane by synthetic asymptote
Author
Chow, Y.L. ; Sarkar, T.K. ; Wan, K.L.
Author_Institution
City Univ. of Hong Kong, Kowloon, China
fYear
2000
fDate
2000
Firstpage
286
Lastpage
289
Abstract
CAD formulas of a microstrip line with a periodically perforated ground plane are derived for possible application in LTCC packages. The derivation is done by the novel technique of synthetic asymptote. Compared with the hardware experiment, the errors of the CAD formulas can be as low as 2%
Keywords
CAD; ceramic packaging; electric impedance; electronic engineering computing; microstrip lines; periodic structures; CAD formulas; LTCC packages; characteristic impedance; microstrip line; perforated ground plane; periodically perforated structure; propagation constant; synthetic asymptote; Ceramics; Circuits; Frequency; Hardware; Impedance; Inductance; Land surface temperature; Microstrip; Packaging; Propagation constant;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2000 Asia-Pacific
Conference_Location
Sydney, NSW
Print_ISBN
0-7803-6435-X
Type
conf
DOI
10.1109/APMC.2000.925790
Filename
925790
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