Title :
CAD formulas of microstrip line with perforated ground plane by synthetic asymptote
Author :
Chow, Y.L. ; Sarkar, T.K. ; Wan, K.L.
Author_Institution :
City Univ. of Hong Kong, Kowloon, China
Abstract :
CAD formulas of a microstrip line with a periodically perforated ground plane are derived for possible application in LTCC packages. The derivation is done by the novel technique of synthetic asymptote. Compared with the hardware experiment, the errors of the CAD formulas can be as low as 2%
Keywords :
CAD; ceramic packaging; electric impedance; electronic engineering computing; microstrip lines; periodic structures; CAD formulas; LTCC packages; characteristic impedance; microstrip line; perforated ground plane; periodically perforated structure; propagation constant; synthetic asymptote; Ceramics; Circuits; Frequency; Hardware; Impedance; Inductance; Land surface temperature; Microstrip; Packaging; Propagation constant;
Conference_Titel :
Microwave Conference, 2000 Asia-Pacific
Conference_Location :
Sydney, NSW
Print_ISBN :
0-7803-6435-X
DOI :
10.1109/APMC.2000.925790
