• DocumentCode
    3133498
  • Title

    CAD formulas of microstrip line with perforated ground plane by synthetic asymptote

  • Author

    Chow, Y.L. ; Sarkar, T.K. ; Wan, K.L.

  • Author_Institution
    City Univ. of Hong Kong, Kowloon, China
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    286
  • Lastpage
    289
  • Abstract
    CAD formulas of a microstrip line with a periodically perforated ground plane are derived for possible application in LTCC packages. The derivation is done by the novel technique of synthetic asymptote. Compared with the hardware experiment, the errors of the CAD formulas can be as low as 2%
  • Keywords
    CAD; ceramic packaging; electric impedance; electronic engineering computing; microstrip lines; periodic structures; CAD formulas; LTCC packages; characteristic impedance; microstrip line; perforated ground plane; periodically perforated structure; propagation constant; synthetic asymptote; Ceramics; Circuits; Frequency; Hardware; Impedance; Inductance; Land surface temperature; Microstrip; Packaging; Propagation constant;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2000 Asia-Pacific
  • Conference_Location
    Sydney, NSW
  • Print_ISBN
    0-7803-6435-X
  • Type

    conf

  • DOI
    10.1109/APMC.2000.925790
  • Filename
    925790