Optoelectronic Integration for Planar Lightwave Systems in Chip Scale Sensing, Optical Interconnect, and Signal Processing

Author

Jokerst, N. ; Cho, S. ; Seo, S. ; Brooke, M.

Author_Institution

Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC

fYear

2006

fDate

Oct. 2006

Firstpage

945

Lastpage

946

Abstract

This paper focuses on the modeling, design, fabrication, and test of planar lightwave structures composed of multiple materials that are integrated together, including passive and active optical components and electronic circuits. The heterogeneous integration of thin film compound semiconductor active devices embedded in passive optical polymer structures will be described. The integration platforms for these structures include Si, Si CMOS, and FR-4 printed wiring boards

Keywords

integrated optoelectronics; optical interconnections; optical planar waveguides; optical polymers; semiconductor thin films; FR-4 printed wiring board; active optical component; chip scale sensing; electronic circuit; heterogeneous integration; optical interconnect; optoelectronic integration; passive optical component; passive optical polymer structure; planar lightwave system; semiconductor active device; signal processing; thin film compound; Circuit testing; Electronic equipment testing; Materials testing; Optical design; Optical device fabrication; Optical devices; Optical interconnections; Optical materials; Optical signal processing; Semiconductor materials;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE

Conference_Location

Montreal, Que.

Print_ISBN

0-7803-9555-7

Electronic_ISBN

0-7803-9555-7

Type

conf

DOI

10.1109/LEOS.2006.279179

Filename

4054501