DocumentCode
3133559
Title
Achieving higher yield through diagnosis-the ASIC perspective
Author
Schuermyer, Chris
Author_Institution
LSI Logic Corp., CA
fYear
2005
fDate
8-8 Nov. 2005
Lastpage
1309
Abstract
Yield learning is more important to ASIC vendors than ever. The high cost of developing a 90 nm ASIC will result in a smaller number of high volume devices. Achieving yield goals during production ramp can be the difference between product success and failure. Yield and Product engineers are faced with all of the traditional fabrication issues, like particle related defects and device model matching, which have always made yield learning a challenge. Several new trends are taking hold with sub-130 nm processing that will make yield learning even more of a challenge in the future
Keywords
application specific integrated circuits; fault diagnosis; integrated circuit modelling; integrated circuit testing; integrated circuit yield; 90 nm; ASIC IP; ASIC yield diagnosis; device model matching; foundry models; particle related defects; pattern related yield limiters; Application specific integrated circuits; Failure analysis; Foundries; Graphics; Integrated circuit yield; Lithography; Logic; Manufacturing processes; Process design; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location
Austin, TX
Print_ISBN
0-7803-9038-5
Type
conf
DOI
10.1109/TEST.2005.1584126
Filename
1584126
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