DocumentCode
3133573
Title
Detection of underfill epoxy defects in flip chip packages with the aid of SAM, parallel polishing and FIB
Author
Tang, T.N. ; Heng, H.C. ; Chan, S.Y. ; Hiew, Marshall
Author_Institution
Dept. of Quality Eng., Adv. Micro Devices, Penang, Malaysia
fYear
1999
fDate
1999
Firstpage
50
Lastpage
54
Abstract
This paper describes the techniques of scanning acoustic microscopy (SAM), parallel polishing and focused ion beam (FIB) cross-sectioning used to detect and identify underfill defects in C4 flip chip packages
Keywords
acoustic microscopy; encapsulation; flip-chip devices; focused ion beam technology; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; polishing; C4 flip chip packages; FIB; FIB cross-sectioning; SAM; flip chip packages; focused ion beam cross-sectioning; parallel polishing; scanning acoustic microscopy; underfill defects; underfill epoxy defect detection; underfill epoxy defects; Acoustic devices; Acoustic signal detection; Acoustical engineering; Flip chip; Integrated circuit packaging; Integrated circuit technology; Ion beams; Laboratories; Microscopy; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 1999. Proceedings of the 1999 7th International Symposium on the
Print_ISBN
0-7803-5187-8
Type
conf
DOI
10.1109/IPFA.1999.791303
Filename
791303
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