• DocumentCode
    3133574
  • Title

    Study on test generation and diagnosis optimization algorithm for wiring interconnects

  • Author

    Chunling, Yang ; Liangang, Huang ; Min, Zhu

  • Author_Institution
    Sch. of Electr. Eng. & Autom., Harbin Inst. of Technol., Harbin, China
  • fYear
    2010
  • fDate
    15-17 June 2010
  • Firstpage
    555
  • Lastpage
    559
  • Abstract
    With the increasing number of chips with boundary-scan structure, boundary-scan technique becomes a new and effective way of test and design-for-testability for VLSI circuits. Because of the serial nature of the boundary scan tests, it is important to minimize the test size while maintaining diagnosability. This paper analyzes the advantages and deficiencies of traditional test generation and diagnosis algorithm for wiring interconnects. In addition, we present an optimal algorithm, Equal-Weight & Min-Distance Algorithm. It achieves a good trade-off between test compactness and diagnosability. It can effectively reduce test time and improve fault diagnosability.
  • Keywords
    VLSI; automatic test pattern generation; boundary scan testing; circuit optimisation; design for testability; fault diagnosis; integrated circuit interconnections; integrated circuit testing; VLSI circuit; boundary scan test; boundary-scan technique; design-for-testability; diagnosis optimization; equal-weight algorithm; fault diagnosability; min-distance algorithm; optimal algorithm; test compactness; test generation; wiring interconnects; Automatic testing; Circuit faults; Circuit testing; Design automation; Integrated circuit interconnections; Legged locomotion; Pins; Printed circuits; Registers; Wiring; Boundary-Scan; Diagnosis; Interconnect Test; Test Generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications (ICIEA), 2010 the 5th IEEE Conference on
  • Conference_Location
    Taichung
  • Print_ISBN
    978-1-4244-5045-9
  • Electronic_ISBN
    978-1-4244-5046-6
  • Type

    conf

  • DOI
    10.1109/ICIEA.2010.5517080
  • Filename
    5517080