DocumentCode :
3133872
Title :
Latent damage investigation on lateral non-uniform charge generation and stress-induced leakage current in silicon dioxides subjected to low-level electrostatic discharge impulse stressing
Author :
Lim, P.S. ; Chim, W.K.
Author_Institution :
Centre for Integrated Circuit Failure Analysis & Reliability, Nat. Univ. of Singapore, Singapore
fYear :
1999
fDate :
1999
Firstpage :
156
Lastpage :
161
Abstract :
This paper reports on the generation of positive lateral nonuniform (LNU) charges in silicon dioxide (SiO2), following low-level electrostatic discharge (ESD) stress using a transmission line pulsing technique. Using an array of charged equivalent small-area MOS capacitors with similar areas to represent the LNU charges, we can explain the effect of LNU charges on the experimental high frequency C-V (HFCV) curves. The formation of LNU charges was attributed to the localised injection of avalanche hot-carriers from the silicon substrate together with the accompanying impact ionisation within the oxide. A short stressing pulse duration was found to be critical for the LNU-charge formation, as uniform charge trapping will result for longer duration stress pulses. A relationship between the generated LNU charges and stress-induced leakage current (SILC) was also observed and discussed in this article
Keywords :
MOS capacitors; dielectric thin films; electric breakdown; electron traps; electrostatic discharge; hole traps; hot carriers; impact ionisation; integrated circuit reliability; integrated circuit testing; leakage currents; silicon compounds; HFCV curves; LNU charges; SILC; Si; SiO2; SiO2-Si; charged equivalent small-area MOS capacitor array; high frequency C-V curves; impact ionisation; latent damage; lateral non-uniform charge generation; localised avalanche hot-carrier injection; low-level ESD stress; low-level electrostatic discharge impulse stressing; positive lateral nonuniform charges; silicon dioxide; silicon dioxides; silicon substrate; stress-induced leakage current; stressing pulse duration; transmission line pulsing technique; uniform charge trapping; Capacitance-voltage characteristics; Electrostatic discharge; Frequency; Hot carrier injection; Hot carriers; Impact ionization; MOS capacitors; Silicon compounds; Stress; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 1999. Proceedings of the 1999 7th International Symposium on the
Print_ISBN :
0-7803-5187-8
Type :
conf
DOI :
10.1109/IPFA.1999.791326
Filename :
791326
Link To Document :
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