• DocumentCode
    3133913
  • Title

    Influence of de-bubbling on crystal structure and magnetic properties of electrodeposited CoNiP layers

  • Author

    Tseng, B. ; Xu, Z. ; Chang, C. ; Hsiao, C. ; Liu, S. ; Hsiao, S. ; Sung, C. ; Chin, T.

  • Author_Institution
    Mater. Sci. & Eng., Feng Chia Univ., Taiching, Taiwan
  • fYear
    2015
  • fDate
    11-15 May 2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Hard magnetic layers have been motivated in the development of microelectromechanical systems (MEMS) components such as micro-actuators, field generators, and micro-motors. Electrodeposition (ED) has been an efficient and cost-effective way to fabricate these magnetic components due to its fast deposition rate and compatibility with lithographic patterns. Electrodeposited CoNiP layers exhibit high coercivity and magnetic energy density which are suitable for use in MEMS. Nevertheless, hydrogen bubbles are unavoidable during ED giving rise to detrimental surface morphology, microstructure and film adhesion to substrate. Therefore, how to eliminate H2 bubbles is vital during ED. In this paper, we report the manifest effects of stirring methods on crystal structure and magnetic properties of ED CoNiP layers.
  • Keywords
    adhesion; bubbles; cobalt alloys; coercive force; crystal microstructure; crystal structure; electrodeposition; magnetic thin films; metallic thin films; nickel alloys; permanent magnets; phosphorus alloys; surface morphology; CoNiP; coercivity; crystal structure; debubbling; detrimental surface morphology; electrodeposited CoNiP layers; fast deposition rate; field generators; film adhesion; hard magnetic layers; hydrogen bubbles; lithographic patterns; magnetic energy density; microactuators; microelectromechanical system components; micromotors; microstructure; stirring method effects; Crystals; Magnetic hysteresis; Magnetic properties; Magnetometers; Nitrogen; Perpendicular magnetic anisotropy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference (INTERMAG), 2015 IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-7321-7
  • Type

    conf

  • DOI
    10.1109/INTMAG.2015.7157192
  • Filename
    7157192