DocumentCode
3134026
Title
The impact of pseudomorphic AlAs spacer layers on the gate leakage current of InAlAs/InGaAs heterostructure field-effect transistors
Author
Auer, U. ; Reuter, R. ; Ellrodt, P. ; Heedt, C. ; Prost, W. ; Tegude, F.J.
Author_Institution
Solid- State Electron. Dept., Duisburg Univ., Germany
fYear
1995
fDate
9-13 May 1995
Firstpage
424
Lastpage
427
Abstract
Pseudomorphic AlAs layers as hole barriers have been inserted in the spacer of InAlAs/InGaAs HFETs. The channel-gate transfer rate of the holes exponentially decreases with AlAs layer thickness, but the absolute reduction factor is low. The optimum AlAs hole barrier thickness, which is only limited by the critical thickness, can be evaluated as 2.0-2.4 nm (about 8 monolayers). The reduction factor is larger than 2. Despite the large lattice-mismatch of the AlAs layer, no degradation in transport and device performance of type 8 ML could be observed, as demonstrated by the drain- and gate-characteristics. The excellent transport, DC- and RF-data of type 8 ML and the low gate leakage current demonstrate the potential of pseudomorphic AlAs containing spacer layers
Keywords
III-V semiconductors; aluminium compounds; field effect transistors; gallium arsenide; impact ionisation; indium compounds; leakage currents; microwave field effect transistors; 2 to 2.4 nm; AlAs; AlAs hole barrier thickness; InAlAs-InGaAs; InAlAs/InGaAs heterostructure field-effect transistors; RF characteristics; channel-gate transfer rate; drain characteristics; gate characteristics; gate drain breakdown voltage; gate leakage current; hole barriers; impact ionization; lattice-mismatch; pseudomorphic AlAs spacer layers; transport performance; type 8 ML; Degradation; HEMTs; Impact ionization; Indium compounds; Indium gallium arsenide; Indium phosphide; Leakage current; MODFETs; Temperature; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on
Conference_Location
Hokkaido
Print_ISBN
0-7803-2147-2
Type
conf
DOI
10.1109/ICIPRM.1995.522170
Filename
522170
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