• DocumentCode
    3134026
  • Title

    The impact of pseudomorphic AlAs spacer layers on the gate leakage current of InAlAs/InGaAs heterostructure field-effect transistors

  • Author

    Auer, U. ; Reuter, R. ; Ellrodt, P. ; Heedt, C. ; Prost, W. ; Tegude, F.J.

  • Author_Institution
    Solid- State Electron. Dept., Duisburg Univ., Germany
  • fYear
    1995
  • fDate
    9-13 May 1995
  • Firstpage
    424
  • Lastpage
    427
  • Abstract
    Pseudomorphic AlAs layers as hole barriers have been inserted in the spacer of InAlAs/InGaAs HFETs. The channel-gate transfer rate of the holes exponentially decreases with AlAs layer thickness, but the absolute reduction factor is low. The optimum AlAs hole barrier thickness, which is only limited by the critical thickness, can be evaluated as 2.0-2.4 nm (about 8 monolayers). The reduction factor is larger than 2. Despite the large lattice-mismatch of the AlAs layer, no degradation in transport and device performance of type 8 ML could be observed, as demonstrated by the drain- and gate-characteristics. The excellent transport, DC- and RF-data of type 8 ML and the low gate leakage current demonstrate the potential of pseudomorphic AlAs containing spacer layers
  • Keywords
    III-V semiconductors; aluminium compounds; field effect transistors; gallium arsenide; impact ionisation; indium compounds; leakage currents; microwave field effect transistors; 2 to 2.4 nm; AlAs; AlAs hole barrier thickness; InAlAs-InGaAs; InAlAs/InGaAs heterostructure field-effect transistors; RF characteristics; channel-gate transfer rate; drain characteristics; gate characteristics; gate drain breakdown voltage; gate leakage current; hole barriers; impact ionization; lattice-mismatch; pseudomorphic AlAs spacer layers; transport performance; type 8 ML; Degradation; HEMTs; Impact ionization; Indium compounds; Indium gallium arsenide; Indium phosphide; Leakage current; MODFETs; Temperature; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on
  • Conference_Location
    Hokkaido
  • Print_ISBN
    0-7803-2147-2
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1995.522170
  • Filename
    522170