Study of thermal interfaces aging for power electronics applications

Author

Ousten, J. -P ; Khatir, Z. ; Ménager, L.

Author_Institution

Lab. of New Technol., Inst. of Sci. & Technol. of Transp., Versailles, France

fYear

2011

fDate

20-24 March 2011

Firstpage

10

Lastpage

17

Abstract

This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone more than 850 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30% decrease of initial thermal resistance.

Keywords

ageing; graphite; phase change materials; polymers; power electronics; thermal conductivity; C; aging indicator; avionic temperature mission profile; graphite; phase change material thermal interface; polymer; power electronic applications; temperature -50 degC to 150 degC; thermal conductivity; thermal cycling conditions; thermal interface aging; thermal interface materials; Aging; Conductivity; Heating; Temperature measurement; Thermal conductivity; Thermal resistance; Material interface degradation; Static thermal characterization; Thermal Interface Material; Thermal aging; Thermal conductivity; Transient thermal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

978-1-61284-740-5

Type

conf

DOI

10.1109/STHERM.2011.5767171

Filename

5767171