Title :
Study of thermal interfaces aging for power electronics applications
Author :
Ousten, J. -P ; Khatir, Z. ; Ménager, L.
Author_Institution :
Lab. of New Technol., Inst. of Sci. & Technol. of Transp., Versailles, France
Abstract :
This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone more than 850 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30% decrease of initial thermal resistance.
Keywords :
ageing; graphite; phase change materials; polymers; power electronics; thermal conductivity; C; aging indicator; avionic temperature mission profile; graphite; phase change material thermal interface; polymer; power electronic applications; temperature -50 degC to 150 degC; thermal conductivity; thermal cycling conditions; thermal interface aging; thermal interface materials; Aging; Conductivity; Heating; Temperature measurement; Thermal conductivity; Thermal resistance; Material interface degradation; Static thermal characterization; Thermal Interface Material; Thermal aging; Thermal conductivity; Transient thermal analysis;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-61284-740-5
DOI :
10.1109/STHERM.2011.5767171
