Title :
Design and characterization of NCD piezoresistive strain sensor
Author :
Kulha, P. ; Boura, A. ; Husak, M. ; Kromka, A. ; Babchenko, O.
Author_Institution :
Czech Tech. Univ., Prague, Czech Republic
Abstract :
Nanocrystalline Diamond (NCD) is a very promising material for fabrication of high-temperature devices because of its unique mechanical and electrical properties. The prospective of using diamond is not only in sensors (MEMS) but in RF and power electronic as well. The strain gauges based on nanocrystalline diamond layers have been successfully designed and fabricated using mainly domestic technological background. The CoventorWare FEM calculations of the mechanical stress and geometrical deformations of a 3-D structure are used for a proper localization of the piezoresistor on the carrying substrate. The boron-doped piezoresistive sensing element was realized using a directed patterned growth of NCD film on SiO2/Si by microwave plasma enhanced chemical vapor deposition (CVD). Cantilever beam configuration was used for sensor characterization. The sheet resistance of tensometric layers as well as contact edge resistivity were measured by Transmission Line Method (TLM). The gauge factor of boron-doped NCD films was investigated in the range from room temperature up to 250degC and from 0 to 1 N of applied force.
Keywords :
contact resistance; deformation; diamond; electric resistance; finite element analysis; microsensors; nanostructured materials; nanotechnology; piezoresistive devices; plasma CVD; power electronics; strain gauges; strain sensors; 3-D structure; C; CVD; CoventorWare FEM calculations; MEMS; RF electronic; boron-doped films; boron-doped piezoresistive sensing element; contact edge resistivity; gauge factor; geometrical deformations; high-temperature devices; mechanical stress; microwave plasma enhanced chemical vapor deposition; nanocrystalline diamond layers; piezoresistive strain sensor; piezoresistor; power electronic; sheet resistance; strain gauges; tensometric layers; transmission line method; Capacitive sensors; Fabrication; Mechanical factors; Mechanical sensors; Micromechanical devices; Nanoscale devices; Piezoresistance; Plasma measurements; Plasma temperature; Sensor phenomena and characterization;
Conference_Titel :
Industrial Electronics, 2009. ISIE 2009. IEEE International Symposium on
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-4347-5
Electronic_ISBN :
978-1-4244-4349-9
DOI :
10.1109/ISIE.2009.5222002