DocumentCode
3134779
Title
Design and characterization of NCD piezoresistive strain sensor
Author
Kulha, P. ; Boura, A. ; Husak, M. ; Kromka, A. ; Babchenko, O.
Author_Institution
Czech Tech. Univ., Prague, Czech Republic
fYear
2009
fDate
5-8 July 2009
Firstpage
121
Lastpage
126
Abstract
Nanocrystalline Diamond (NCD) is a very promising material for fabrication of high-temperature devices because of its unique mechanical and electrical properties. The prospective of using diamond is not only in sensors (MEMS) but in RF and power electronic as well. The strain gauges based on nanocrystalline diamond layers have been successfully designed and fabricated using mainly domestic technological background. The CoventorWare FEM calculations of the mechanical stress and geometrical deformations of a 3-D structure are used for a proper localization of the piezoresistor on the carrying substrate. The boron-doped piezoresistive sensing element was realized using a directed patterned growth of NCD film on SiO2/Si by microwave plasma enhanced chemical vapor deposition (CVD). Cantilever beam configuration was used for sensor characterization. The sheet resistance of tensometric layers as well as contact edge resistivity were measured by Transmission Line Method (TLM). The gauge factor of boron-doped NCD films was investigated in the range from room temperature up to 250degC and from 0 to 1 N of applied force.
Keywords
contact resistance; deformation; diamond; electric resistance; finite element analysis; microsensors; nanostructured materials; nanotechnology; piezoresistive devices; plasma CVD; power electronics; strain gauges; strain sensors; 3-D structure; C; CVD; CoventorWare FEM calculations; MEMS; RF electronic; boron-doped films; boron-doped piezoresistive sensing element; contact edge resistivity; gauge factor; geometrical deformations; high-temperature devices; mechanical stress; microwave plasma enhanced chemical vapor deposition; nanocrystalline diamond layers; piezoresistive strain sensor; piezoresistor; power electronic; sheet resistance; strain gauges; tensometric layers; transmission line method; Capacitive sensors; Fabrication; Mechanical factors; Mechanical sensors; Micromechanical devices; Nanoscale devices; Piezoresistance; Plasma measurements; Plasma temperature; Sensor phenomena and characterization;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, 2009. ISIE 2009. IEEE International Symposium on
Conference_Location
Seoul
Print_ISBN
978-1-4244-4347-5
Electronic_ISBN
978-1-4244-4349-9
Type
conf
DOI
10.1109/ISIE.2009.5222002
Filename
5222002
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