DocumentCode :
3135568
Title :
Carbon nanotubes based engineering materials for thermal management applications
Author :
Datsyuk, Vitaliy ; Firkowska, Izabela ; Gharagozloo-Hubmann, Kati ; Lisunova, Milana ; Vogt, Anna-Maria ; Boden, André ; Kasimir, Maria ; Trotsenko, Svitlana ; Czempiel, Gregor ; Reich, Stephanie
Author_Institution :
Inst. fur Exp. Phys., Freie Univ. Berlin, Berlin, Germany
fYear :
2011
fDate :
20-24 March 2011
Firstpage :
325
Lastpage :
332
Abstract :
We developed innovative solutions for reaching high performance in carbon-nanotube-filled engineering materials. Electrospinning was applied to improve the thermal conductivity in polymer composites via the alignment of nanotubes in a polymer matrix. Alignment was achieved by flow-confinement and charge-induced alignment during electrospinning. Additionally, the use of liquid crystal polymer as a matrix increased the degree of alignment leading to the remarkable increase of the thermal conductivity in composites by a factor 33. We developed the reduction from method to produce metal-matrix composites filled with carbon nanotubes. We were able to engineer the coefficient of thermal expansion (CTE) of the copper composite, for example 3 wt% of carbon nanotubes added to copper yielded CTEs comparable with ceramics and semiconductors. In situ thermal polymerization of natural oils (plant and fish) was applied to produce nanotubes-based thermal greases. This method creates novel, environmentally friendly thermal grease with excellent thermal conductivity (increased by a factor 12), that is easy to handle compound and to remove. Such thermal greases can be applied to surfaces by various methods, including screen printing, and demonstrate good thermal stability, reduced thermal expansion, and no pumping-out effect.
Keywords :
carbon nanotubes; composite materials; electrospinning; liquid crystal polymers; polymerisation; thermal conductivity; thermal expansion; thermal management (packaging); thermal stability; C-Cu; carbon nanotubes; coefficient of thermal expansion; electrospinning; engineering materials; liquid crystal polymer; metal-matrix composites; polymer composites; polymer matrix; screen printing; thermal conductivity; thermal management applications; thermal polymerization; thermal stability; Carbon nanotubes; Conductivity; Copper; Optical fiber polarization; Polymers; Thermal conductivity; Carbon nanotube; coefficient of thermal expansion; engineering composites; metal; polymer; polyol; thermal conductivity; thermal interface material;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
978-1-61284-740-5
Type :
conf
DOI :
10.1109/STHERM.2011.5767219
Filename :
5767219
Link To Document :
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