• DocumentCode
    3135646
  • Title

    InP/InGaAs nanofabrication and optical characterization

  • Author

    Forchel, A. ; Schilling, O. ; Wang, K.H. ; Ils, P. ; Oshinowo, J. ; Kieseling, F. ; Braun, W.

  • Author_Institution
    Wurzburg Univ., Germany
  • fYear
    1995
  • fDate
    9-13 May 1995
  • Firstpage
    660
  • Lastpage
    663
  • Abstract
    We have developed InGaAs/InP quantum wires and quantum dots with lateral extensions below 20 nm by high resolution electron beam lithography and wet chemical etching. In contrast to dry etched structures the wet etched wires and dots are found to be virtually free of significant optically inactive (“dead”) sidewall layers. Time resolved measurements yield rather long lifetimes of about 500 ps for 20 nm wide deep etched wires. The luminescence of the wires and dots shows a strong shift to higher energy as well as features due to transitions between up to four lateral subbands when the characteristic widths is reduced below 50 nm. Due to the absence of optically inactive sidewall layers the size variation of the emission energy can be modeled quantitatively based on the measured widths of the nanostructures
  • Keywords
    III-V semiconductors; electron beam lithography; etching; gallium arsenide; indium compounds; nanotechnology; photoluminescence; radiative lifetimes; semiconductor quantum dots; semiconductor quantum wires; time resolved spectra; InP-InGaAs; dead layers; electron beam lithography; lifetimes; luminescence; nanofabrication; optical properties; quantum dots; quantum wires; sidewall layers; subband transitions; time resolved measurements; wet chemical etching; Dry etching; Electron beams; Electron optics; Indium gallium arsenide; Indium phosphide; Lithography; Nanofabrication; Quantum dots; Wet etching; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on
  • Conference_Location
    Hokkaido
  • Print_ISBN
    0-7803-2147-2
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1995.522230
  • Filename
    522230