DocumentCode :
3135779
Title :
Invited tutorial: Energy efficient multi-Gb/s I/O: Circuit and system design techniques
Author :
Casper, Bryan
Author_Institution :
Intel Circuit Res. Labs., Hillsboro, OR, USA
fYear :
2011
fDate :
22-22 April 2011
Firstpage :
1
Lastpage :
1
Abstract :
Abstract form only given. Chip-to-chip I/O data rates continue to scale aggressively to keep up with demands brought on by multi-core CPU-based computer and networking systems. Due to increasing bandwidth needs and declining system power budgets, dramatically improving I/O energy efficiency is crucial and is the major challenge currently facing the computer and networking industry. A multi-pronged approach to I/O power reduction will be presented, employing both circuit and interconnect optimization. The use of system level modeling and optimization to co-design the packaging, board interconnect, channel, transmitter, receiver, and clocking will be advocated with examples that demonstrate minimum-power I/O systems. I/O energy reduction depends on both active power minimization as well as the use of aggressive power management methods. Techniques and corresponding examples will be shown that demonstrate I/O power management including dynamic voltage and frequency scaling, low-power standby, and fast wake-up times. This session will provide insight into the challenges and opportunities associated with each low-power technique, using case studies to illustrate state-of-the-art low-power I/O systems.
Keywords :
integrated circuit interconnections; microprocessor chips; I/O power reduction; active power minimization; aggressive power management; board interconnect; chip-to-chip I/O data rates; circuit optimization; dynamic voltage and frequency scaling; energy efficient multi-Gb/s I/O; interconnect optimization; system level modeling; system power budgets; wake-up times; Computational modeling; Computers; Energy efficiency; Integrated circuit interconnections; Integrated circuit modeling; Optimization; Time frequency analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics and Electron Devices (WMED), 2011 IEEE Workshop on
Conference_Location :
Boise, ID
ISSN :
1947-3834
Print_ISBN :
978-1-4244-9740-9
Type :
conf
DOI :
10.1109/WMED.2011.5767268
Filename :
5767268
Link To Document :
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