• DocumentCode
    3135779
  • Title

    Invited tutorial: Energy efficient multi-Gb/s I/O: Circuit and system design techniques

  • Author

    Casper, Bryan

  • Author_Institution
    Intel Circuit Res. Labs., Hillsboro, OR, USA
  • fYear
    2011
  • fDate
    22-22 April 2011
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Abstract form only given. Chip-to-chip I/O data rates continue to scale aggressively to keep up with demands brought on by multi-core CPU-based computer and networking systems. Due to increasing bandwidth needs and declining system power budgets, dramatically improving I/O energy efficiency is crucial and is the major challenge currently facing the computer and networking industry. A multi-pronged approach to I/O power reduction will be presented, employing both circuit and interconnect optimization. The use of system level modeling and optimization to co-design the packaging, board interconnect, channel, transmitter, receiver, and clocking will be advocated with examples that demonstrate minimum-power I/O systems. I/O energy reduction depends on both active power minimization as well as the use of aggressive power management methods. Techniques and corresponding examples will be shown that demonstrate I/O power management including dynamic voltage and frequency scaling, low-power standby, and fast wake-up times. This session will provide insight into the challenges and opportunities associated with each low-power technique, using case studies to illustrate state-of-the-art low-power I/O systems.
  • Keywords
    integrated circuit interconnections; microprocessor chips; I/O power reduction; active power minimization; aggressive power management; board interconnect; chip-to-chip I/O data rates; circuit optimization; dynamic voltage and frequency scaling; energy efficient multi-Gb/s I/O; interconnect optimization; system level modeling; system power budgets; wake-up times; Computational modeling; Computers; Energy efficiency; Integrated circuit interconnections; Integrated circuit modeling; Optimization; Time frequency analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Electron Devices (WMED), 2011 IEEE Workshop on
  • Conference_Location
    Boise, ID
  • ISSN
    1947-3834
  • Print_ISBN
    978-1-4244-9740-9
  • Type

    conf

  • DOI
    10.1109/WMED.2011.5767268
  • Filename
    5767268