DocumentCode :
3135784
Title :
Interface strain in InGaAs-InP superlattices
Author :
Clawson, A.R. ; Hanson, C.M.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
fYear :
1995
fDate :
9-13 May 1995
Firstpage :
689
Lastpage :
692
Abstract :
We have studied the strain in OMVPE grown ultra thin As compound layers in InP and P-compound layers in GaAs to assess interface behavior relevant to InGaAs/InP heterojunctions. Strain contributions from As-P exchange at the heterojunction interfaces were identified. The very rapid replacement of P by As from AsH3 and the slower replacement of As by P from PH3 results in a rapidly formed strain contribution from InAs rich interfaces for superlattices on InP substrates. An additional InAs-like strain in the inserted layers is proportional to the growth time and is attributed to carryover at the upper interface of excess adsorbed surface As into the InP overlayer. P interaction with As-compounds is sufficiently slow that excess negative strain occurs only when deliberate growth interrupts under PH3 are introduced into superlattices grown on GaAs substrates, and P incorporation behaves more like diffusion into the underlying GaAs rather than as P carryover into the GaAs overlayer. Under our normal growth conditions, growth of thin GaP-compound layers on GaAs incorporates residual As at an exact 50% As-50% P ratio
Keywords :
III-V semiconductors; chemical interdiffusion; gallium arsenide; indium compounds; interface structure; semiconductor growth; semiconductor superlattices; vapour phase epitaxial growth; As-P exchange; GaAs overlayer; GaAs substrates; InAs rich interfaces; InAs-like strain; InGaAs-InP; InGaAs-InP superlattices; InGaAs/InP heterojunctions; InP; InP substrates; OMVPE grown ultra thin As compound layers; P carryover; P incorporation; P-compound layers; diffusion; excess adsorbed surface As; excess negative strain; growth time; inserted layers; interface behavior; interface strain; strain contribution; Atomic measurements; Bonding; Capacitive sensors; Crystallization; Heterojunctions; Indium phosphide; Lattices; Strain measurement; Superlattices; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on
Conference_Location :
Hokkaido
Print_ISBN :
0-7803-2147-2
Type :
conf
DOI :
10.1109/ICIPRM.1995.522237
Filename :
522237
Link To Document :
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