DocumentCode
3136186
Title
High temperature flow stress model and hot deformation behaviors of high Mo austenitic stainless steel
Author
Yourong, Xu ; Liangshen, Chen ; Lei, Jin ; Deying, Wang
Author_Institution
Sch. of Mater. Sci. & Eng., Shanghai Univ., China
Volume
2
fYear
1999
fDate
1999
Firstpage
805
Abstract
Single stage and double stage interrupted hot compression tests on the Thermecmastor-Z simulator for physical simulating hot rolling have been carried out for a 00Cr20Ni18Mo6Cu[N] austenitic stainless steel under the high temperature range from 1223 to 1373 K and various strain rates. The dynamic and static mechanical behavior and microstructure evolution of the steel were studied. The deformation activation energies of dynamic, static and metadynamic recrystallization were calculated. A serials of perfect flow stress models considering dynamic recrystallization were established. The predicted results agree well with the experiment data. Kinetic modeling of metadynamic and static recrystallization has also been determined
Keywords
austenitic stainless steel; crystal microstructure; hot rolling; plastic flow; recrystallisation; softening (metallurgical); 1223 to 1373 K; Avrami coefficient; Thermecmastor-Z simulator; deformation activation energies; double stage tests; dynamic mechanical behavior; dynamic recrystallization; dynamic softening; high temperature flow stress model; high-Mo austenitic stainless steel; hot deformation behavior; hot rolling simulation; interrupted hot compression tests; metadynamic recrystallization; microstructure evolution; single stage tests; static mechanical behavior; static recrystallization; various strain rates; workability; Capacitive sensors; Conducting materials; Deformable models; Equations; Iron alloys; Microstructure; Nitrogen; Ocean temperature; Steel; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Processing and Manufacturing of Materials, 1999. IPMM '99. Proceedings of the Second International Conference on
Conference_Location
Honolulu, HI
Print_ISBN
0-7803-5489-3
Type
conf
DOI
10.1109/IPMM.1999.791490
Filename
791490
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