Wideband characterization of multiple bondwires for millimeter-wave applications

Author

Kim, Jin-yang ; Lee, Hai-Young ; Lee, Jae-hyun ; Chang, Dong-pil

Author_Institution

Dept. of Electron. Eng., Ajou Univ., Suwon, South Korea

fYear

2000

fDate

2000

Firstpage

1265

Lastpage

1268

Abstract

Wirebonding is a common interconnection for modern microwave devices because of the rather simple and reliable processes involved. At millimeter-wave frequencies, however, the bondwire parasitics are significant and consequently limit the external performance of packaged devices. In this paper, we represent wideband characterizations of single, double, triple bondwires in a frequency range from 20 to 35 GHz. The measured results show that the double bondwire is comparable to the ribbon in terms of the insertion loss, and the wirebonding is very suitable for millimeter-wave packaging by virtue of the performance and the manufacturing cost

Keywords

finite element analysis; hybrid integrated circuits; integrated circuit interconnections; integrated circuit packaging; lead bonding; losses; millimetre wave integrated circuits; multichip modules; 20 to 35 GHz; EHF; FEM; MCM; MM-wave packaging; bondwire parasitics; chip interconnection; double bondwires; insertion loss; manufacturing cost; millimeter-wave applications; modules; multiple bondwires; packaged devices; single bondwires; triple bondwires; wideband characterization; wirebonding; Bonding; Frequency; Insertion loss; Loss measurement; Manufacturing; Microwave devices; Millimeter wave measurements; Packaging; Performance loss; Wideband;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2000 Asia-Pacific

Conference_Location

Sydney, NSW

Print_ISBN

0-7803-6435-X

Type

conf

DOI

10.1109/APMC.2000.926064

Filename

926064