• DocumentCode
    3136958
  • Title

    Design and characterization of CPW feedthroughs in multi-layer thin-film MCM-D

  • Author

    Carchon, G. ; Vaesen, K. ; Brebels, S. ; De Raedt, W. ; Nauwelaers, B.

  • Author_Institution
    Katholieke Univ., Leuven, Belgium
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1269
  • Lastpage
    1272
  • Abstract
    We report on the design and characterization of CPW feedthroughs for RF and microwave applications in multi-layer thin-film MCM-D. Using 3-D simulations, it is shown that, for analysis purposes, the vertical metal wall, can be replaced with a thin (5 μm) metal layer with only a small impact on the actual performance. This equivalent structure can be more easily fabricated as the thin metal layer on the top is directly available in the multi-layer technology. This allows for a faster design and characterization of the feedthrough. The transmission line properties (characteristic impedance and propagation constant) of the intrinsic feedthrough are extracted based on the measurement of two equivalent lines with different length. Measurements indicate that a low-loss (<0.4 dB), well matched feedthrough (return loss below -25 dB) can be realized up to at least 50 GHz (intrinsic feedthrough length of 500 μm)
  • Keywords
    S-parameters; UHF integrated circuits; coplanar waveguide components; losses; microwave integrated circuits; millimetre wave integrated circuits; multichip modules; waveguide transitions; -25 dB; 0.4 dB; 3D simulations; 50 GHz; 500 micron; CPW feedthroughs; RF applications; characteristic impedance; feedthrough characterization; low-loss matched feedthrough; microwave applications; multi-layer thin-film MCM-D; propagation constant; return loss; thin metal layer; transmission line properties; Analytical models; Coplanar waveguides; Impedance measurement; Length measurement; Loss measurement; Performance analysis; Propagation constant; Radio frequency; Transistors; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2000 Asia-Pacific
  • Conference_Location
    Sydney, NSW
  • Print_ISBN
    0-7803-6435-X
  • Type

    conf

  • DOI
    10.1109/APMC.2000.926065
  • Filename
    926065