DocumentCode
3137142
Title
Investigation of Raman imaging for advanced control of YBCO cool-down processing using pulsed laser deposition
Author
Busbee, J.D. ; Biggers, R.R. ; Jones, J.G. ; Dempsey, D.V. ; Kozlowski, G.
Author_Institution
Res. Lab., Wright-Patterson AFB, OH, USA
Volume
2
fYear
1999
fDate
1999
Firstpage
1257
Abstract
Pulsed laser deposition (PLD) is a versatile, complex thin film deposition process that has been shown to be capable of creating high quality YBCO films. However, the promise of the technique has been hampered by a lack of process understanding and visibility into in-situ processes. In the past, attempts at controlling the PLD process have not been highly successful due to a lack of direct feedback from the surface of the film. This paper investigates using Raman spectroscopy to provide feedback from the evolving film during cool-down after deposition. In-situ spectra taken under controlled conditions are examined to understand the effect of environmental parameters on film properties as well to provide insight into evolution of the film microstructure during cool-down
Keywords
Raman spectra; barium compounds; high-temperature superconductors; process control; pulsed laser deposition; stoichiometry; superconducting thin films; yttrium compounds; HTSC cool-down processing; Raman imaging; Raman spectroscopy; YBaCuO; advanced process control; controlled conditions; critical current density; environmental parameters effect; evolving film; feedback; film microstructure; hierarchical process model; in-situ spectra; pulsed laser deposition; stoichiometry; thickness measurement; transition temperature; Feedback; Microstructure; Optical pulses; Process control; Pulsed laser deposition; Raman scattering; Spectroscopy; Sputtering; Temperature control; Yttrium barium copper oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Processing and Manufacturing of Materials, 1999. IPMM '99. Proceedings of the Second International Conference on
Conference_Location
Honolulu, HI
Print_ISBN
0-7803-5489-3
Type
conf
DOI
10.1109/IPMM.1999.791554
Filename
791554
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