Title :
The construction of an embedded vision processing platform for simple automatic die-bonding system
Author :
Wen-zheng, Zhai ; Gong-hu, Guan ; Hai-bo, Zhang ; Qiao-ping, Sun
Author_Institution :
Sch. of Math. & Inf. Eng., Taizhou Univ., Taizhou, China
Abstract :
This paper designs an embedded vision processing platform for simple automatic die-bonding system by using ARM microprocessor as the vision processor, Linux as the operation system and USB camera for image acquisition equipment to complete wafer image acquisition, processing, wafer alignment and defects inspection. After the hardware platform is constructed and the software design is implemented, experimental results show that the platform has good vision processing features in real-time, simplicity and efficiency. The platform is competent for wafer image processing and analysis in die bonders and can be widely applied in the field of industry measurement and control.
Keywords :
Linux; computer vision; embedded systems; image sensors; microassembling; microprocessor chips; production engineering computing; semiconductor device manufacture; ARM microprocessor; Linux; USB camera; defects inspection; embedded vision processing platform; hardware platform; operation system; simple automatic die bonding system; software design; vision processor; wafer alignment; wafer image acquisition; Cameras; Image recognition; Inspection; Linux; Machine vision; Process control;
Conference_Titel :
Intelligent Control and Information Processing (ICICIP), 2011 2nd International Conference on
Conference_Location :
Harbin
Print_ISBN :
978-1-4577-0813-8
DOI :
10.1109/ICICIP.2011.6008426
