• DocumentCode
    3137312
  • Title

    Distance relay mal-operation due to TCSC presence at near end of second circuit of double circuit line in inter phase faults

  • Author

    Jamali, S. ; Kazemi, A. ; Shateri, H.

  • Author_Institution
    Center of Excellence for Power Syst. Autom. & Oper., Iran Univ. of Sci. & Technol., Tehran, Iran
  • fYear
    2009
  • fDate
    5-8 July 2009
  • Firstpage
    35
  • Lastpage
    40
  • Abstract
    This paper discusses the distance relay mal-operation in the case of installation of thyristor controlled series compensator (TCSC), one of the series connected flexible alternating current transmission system (FACTS) devices, on the second circuit of a double circuit transmission line, for inter phase, phase to phase and three phase, faults. This is done by means of presenting the measured impedance at the relaying point in the case of TCSC presence at the near end of the second circuit. The measured impedance at the relaying point is greatly influenced in the presence of TCSC on the line or even in the case of installing TCSC on the near end of the second circuit. The measured impedance depends on many factors including the power system structural conditions, pre-fault loading, fault resistance, and TCSC compensation degree.
  • Keywords
    flexible AC transmission systems; power transmission faults; power transmission lines; power transmission protection; thyristor applications; TCSC; distance relay maloperation; double circuit transmission line; flexible alternating current transmission system devices; impedance; interphase fault; power system structural condition; second circuit transmission line; thyristor controlled series compensator; Circuit faults; Control systems; Electrical resistance measurement; Flexible printed circuits; Impedance measurement; Power capacitors; Power system relaying; Protective relaying; Thyristors; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2009. ISIE 2009. IEEE International Symposium on
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-4347-5
  • Electronic_ISBN
    978-1-4244-4349-9
  • Type

    conf

  • DOI
    10.1109/ISIE.2009.5222615
  • Filename
    5222615