• DocumentCode
    3138536
  • Title

    Design consideration of emitter-base junction structure for InGaP/GaAs heterojunction bipolar transistor

  • Author

    Liu, W.C. ; Chen, J.Y. ; Wang, W.C. ; Feng, S.C. ; Yu, K.H. ; Yan, J.H.

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    246
  • Lastpage
    248
  • Abstract
    An InGaP/GaAs heterojunction bipolar transistor (HBT) with an 50 Å undoped spacer and δ-doping sheet at base-emitter heterointerface is fabricated and studied. A common-emitter current gain of 280 and an offset voltage as small as 55 mV are obtained, respectively. This results show that high current gain and low offset voltage can be attained simultaneously without the passivation of emitter-base junction. From the experimental results, it shows that the potential spike is indeed reduced by the employment of an δ-doped layer and spacer simultaneously. On the other hand, theoretical consideration also shows that the potential spike is removed by inserting a δ-doping sheet between the emitter-base heterointerface
  • Keywords
    III-V semiconductors; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; δ-doping sheet; InGaP-GaAs; common-emitter current gain; emitter-base junction structure; heterojunction bipolar transistor; offset voltage; potential spike; Bipolar transistors; Conducting materials; Doping; Employment; Etching; Gallium arsenide; Heterojunction bipolar transistors; Low voltage; Passivation; Photonic band gap;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronic and Microelectronic Materials Devices, 1998. Proceedings. 1998 Conference on
  • Conference_Location
    Perth, WA
  • Print_ISBN
    0-7803-4513-4
  • Type

    conf

  • DOI
    10.1109/COMMAD.1998.791632
  • Filename
    791632