• DocumentCode
    3138607
  • Title

    Quantitative analysis of composition profiles in quantum well structures using grazing incidence X-ray reflectivity and photoluminescence

  • Author

    Moon, Y. ; Yoon, E.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Seoul Nat. Univ., South Korea
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    260
  • Lastpage
    263
  • Abstract
    A new quantitative analysis method using grazing incidence x-ray reflectivity (GIXR) and photoluminescence (PL) simultaneously (GIXR/PL method), was applied for the first time to obtain the composition profile from an InAsxP1-x/InP single quantum well (SQW) structure. By assuming a Gaussian distribution, the characteristic As carryover length and the total As amount could be quantitatively determined. The As distributions obtained after a PH3 purge were also analyzed by the GIXR/PL method. After a 10 second PH3 purge the total amount of As was reduced from 5.13 monolayers to 2.56 monolayers but its carryover length into InP capping layer was almost constant at about 6 monolayers irrespective of the interruption time. The rate constant for the As re-desorption process in a PH3 ambient was calculated as 0.067 s-1 assuming a first order reaction model
  • Keywords
    III-V semiconductors; X-ray chemical analysis; X-ray reflection; desorption; indium compounds; photoluminescence; semiconductor quantum wells; As distribution; Gaussian distribution; InAsP-InP; composition profiles; desorption; first order reaction model; grazing incidence X-ray reflectivity; photoluminescence; quantitative analysis; single quantum well; Ash; Chemical vapor deposition; Indium phosphide; Materials science and technology; Molecular beam epitaxial growth; Moon; Photoluminescence; Reflectivity; Strain measurement; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronic and Microelectronic Materials Devices, 1998. Proceedings. 1998 Conference on
  • Conference_Location
    Perth, WA
  • Print_ISBN
    0-7803-4513-4
  • Type

    conf

  • DOI
    10.1109/COMMAD.1998.791636
  • Filename
    791636