DocumentCode
3139128
Title
Impurity-free interdiffusion in GaAs/Al0.54Ga0.46 As multiple quantum wells capped with PECVD SiOx: effect of nitrous oxide flow
Author
Deenapanray, P.N.K. ; Tan, H.H. ; Lengyel, J. ; Durandet, A. ; Gal, M. ; Jagadish, C.
Author_Institution
Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
fYear
1999
fDate
1999
Firstpage
361
Lastpage
364
Abstract
Impurity-free vacancy interdiffusion of GaAs/Al0.54Ga 0.46As quantum wells (QWs) was achieved using SiOx capping followed by rapid thermal annealing at 950°C. The SiOx films were plasma deposited using N2O/SiH4 flow at 300°C and 20 W rf power. The stoichiometry of capping layers were altered by varying the flowrate of N2O. In the samples studied, the above process allows continuously variable energy shifts as high as ~15O meV while still maintaining clearly resolved excitonic behavior. The degree of intermixing is not controlled by x only but, also, by the density of the SiOx layers, Our results, therefore, suggest that, in addition to the solid solubility of Ga in SiOx, intermixing in SiOx capped MQW heterostructures depends on the mobility of Ga atoms in the oxide caps
Keywords
III-V semiconductors; aluminium compounds; gallium arsenide; plasma CVD coatings; rapid thermal annealing; semiconductor quantum wells; silicon compounds; surface diffusion; 150 meV; 20 W; 300 C; 950 C; GaAs-Al0.54Ga0.46As-SiO; GaAs/Al0.54Ga0.46As; N2O; PECVD SiOx caps; excitonic behavior; impurity-free interdiffusion; impurity-free vacancy interdiffusion; multiple quantum wells; nitrous oxide flow effects; rapid thermal annealing; solid solubility; stoichiometry; Atomic layer deposition; Gallium arsenide; Monolithic integrated circuits; Plasma immersion ion implantation; Plasma temperature; Quantum well devices; Rapid thermal annealing; Semiconductor films; Solids; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Optoelectronic and Microelectronic Materials Devices, 1998. Proceedings. 1998 Conference on
Conference_Location
Perth, WA
Print_ISBN
0-7803-4513-4
Type
conf
DOI
10.1109/COMMAD.1998.791663
Filename
791663
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