• DocumentCode
    3139128
  • Title

    Impurity-free interdiffusion in GaAs/Al0.54Ga0.46 As multiple quantum wells capped with PECVD SiOx: effect of nitrous oxide flow

  • Author

    Deenapanray, P.N.K. ; Tan, H.H. ; Lengyel, J. ; Durandet, A. ; Gal, M. ; Jagadish, C.

  • Author_Institution
    Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    361
  • Lastpage
    364
  • Abstract
    Impurity-free vacancy interdiffusion of GaAs/Al0.54Ga 0.46As quantum wells (QWs) was achieved using SiOx capping followed by rapid thermal annealing at 950°C. The SiOx films were plasma deposited using N2O/SiH4 flow at 300°C and 20 W rf power. The stoichiometry of capping layers were altered by varying the flowrate of N2O. In the samples studied, the above process allows continuously variable energy shifts as high as ~15O meV while still maintaining clearly resolved excitonic behavior. The degree of intermixing is not controlled by x only but, also, by the density of the SiOx layers, Our results, therefore, suggest that, in addition to the solid solubility of Ga in SiOx, intermixing in SiOx capped MQW heterostructures depends on the mobility of Ga atoms in the oxide caps
  • Keywords
    III-V semiconductors; aluminium compounds; gallium arsenide; plasma CVD coatings; rapid thermal annealing; semiconductor quantum wells; silicon compounds; surface diffusion; 150 meV; 20 W; 300 C; 950 C; GaAs-Al0.54Ga0.46As-SiO; GaAs/Al0.54Ga0.46As; N2O; PECVD SiOx caps; excitonic behavior; impurity-free interdiffusion; impurity-free vacancy interdiffusion; multiple quantum wells; nitrous oxide flow effects; rapid thermal annealing; solid solubility; stoichiometry; Atomic layer deposition; Gallium arsenide; Monolithic integrated circuits; Plasma immersion ion implantation; Plasma temperature; Quantum well devices; Rapid thermal annealing; Semiconductor films; Solids; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronic and Microelectronic Materials Devices, 1998. Proceedings. 1998 Conference on
  • Conference_Location
    Perth, WA
  • Print_ISBN
    0-7803-4513-4
  • Type

    conf

  • DOI
    10.1109/COMMAD.1998.791663
  • Filename
    791663