Title :
A 0.18 /spl mu/m fully depleted CMOS on 30 nm thick SOI for sub-1.0 V operation
Author :
Imai, K. ; Onishi, H. ; Yamaguchi, K. ; Inoue, K. ; Matsubara, Y. ; Ono, A. ; Horiuchi, T.
Author_Institution :
ULSI Device Dev. Lab., NEC Corp., Sagamihara, Japan
Abstract :
A process has been developed for fabricating 0.18 /spl mu/m CMOS devices that have excellent performance at low voltage. It uses fully depleted SOI technology. To suppress degradation of subthreshold slope due to the short channel effect, the SOI film is drastically thinned to 30 nm. An ultra-thin cobalt silicide layer efficiently reduces the high parasitic source/drain resistance that occurs with thin SOI film. The fabricated devices, which keep a subthreshold slope of less than 70 mV/decade, have a switching speed more than 1.5 times faster than that of bulk CMOS devices, when the supply voltage is 1.0 V or less.
Keywords :
MOSFET; low-power electronics; semiconductor device reliability; silicon-on-insulator; 0.18 micron; 1.0 V; 30 nm; Si; fully depleted CMOS; fully depleted SOI technology; low voltage performance; parasitic source/drain resistance; short channel effect; subthreshold slope degradation; switching speed; Cobalt; Fabrication; Immune system; Inverters; MOS devices; MOSFETs; Propagation delay; Thin film devices; Titanium; Voltage;
Conference_Titel :
VLSI Technology, 1998. Digest of Technical Papers. 1998 Symposium on
Conference_Location :
Honolulu, HI, USA
Print_ISBN :
0-7803-4770-6
DOI :
10.1109/VLSIT.1998.689223