• DocumentCode
    314089
  • Title

    Micro bellow actuators

  • Author

    Yang, Xing ; Tai, Yu-Chong ; Ho, Chih-Ming

  • Author_Institution
    Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
  • Volume
    1
  • fYear
    1997
  • fDate
    16-19 Jun 1997
  • Firstpage
    45
  • Abstract
    We report here a novel micromachined bellow-style actuator (microbellow) which uses a smaller real estate but is capable of larger deflections compared to a flat membrane of the same size. In this first demonstration, three-layer silicon nitride microbellows have been successfully fabricated by using polysilicon/TMAH sacrificial layer etching technology. Inside the bellows, runs of sacrificial layer are designed at the joints of every two layers to improve the boundary conditions (i.e., to reduce the stress concentration). By doing this, a 5 times improvement in burst pressure has been achieved. The large deflection of the bellow has also been demonstrated. As an example, a 800 μm diameter circular microbellow made of 1.2 μm thick silicon nitride can deflect more than 50 μm in the center compared to only 13 μm for a flat membrane of the same dimensions. Thermopneumatic actuation of the microbellow is also demonstrated
  • Keywords
    etching; mechanical testing; microactuators; micromachining; pneumatic control equipment; semiconductor device testing; Si; SiO2-Si3N4-Si; boundary conditions; burst pressure; circular microbellow; large deflections; load-deflection tests; microbellow; micromachined bellow-style actuator; polysilicon/TMAH sacrificial layer etching technology; stress concentration; surface micromachining technology; thermopneumatic actuation; three-layer Si3N4 microbellows; Actuators; Aerospace engineering; Bellows; Biomembranes; Boundary conditions; Etching; Fabrication; Microvalves; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-3829-4
  • Type

    conf

  • DOI
    10.1109/SENSOR.1997.613577
  • Filename
    613577