• DocumentCode
    314133
  • Title

    Accelerated testing of anodically bonded glass-silicon packages in salt water

  • Author

    Dokmeci, M.R. ; von Arx, J.A. ; Najafi, K.

  • Author_Institution
    Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA
  • Volume
    1
  • fYear
    1997
  • fDate
    16-19 Jun 1997
  • Firstpage
    283
  • Abstract
    This paper reports long-term accelerated test results of glass-silicon packages in aqueous solutions including phosphate buffered saline (PBS) and de-ionized water. An analysis of the dominant failure mode and the long term biocompatibility of the packages is also performed. Using the accelerated data at 85 and 95°C in saline with an Arrhenius model we calculate an activation energy of 1.26 eV and an expected lifetime of 177 years at 37°C in saline. After an analysis of the failed samples, we find that the main failure mechanism is the dissolution of the polysilicon layer at elevated temperatures in saline, which causes premature failure of the package. In animal models the package is consistently found to be biocompatible and robust after implantation periods of up to a year
  • Keywords
    biomedical equipment; electronic equipment testing; elemental semiconductors; glass; life testing; semiconductor device packaging; silicon; 1.26 eV; 177 y; 37 C; 85 C; 95 C; Arrhenius model; Si; accelerated testing; activation energy; animal models; anodically bonded glass-silicon packages; aqueous solutions; biocompatibility; de-ionized water; dissolution; dominant failure mode; elevated temperatures; failure; glass-silicon packages; implantation periods; phosphate buffered saline; polysilicon layer; salt water; Acceleration; Animals; Bonding; Failure analysis; Life estimation; Packaging; Performance analysis; Robustness; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-3829-4
  • Type

    conf

  • DOI
    10.1109/SENSOR.1997.613639
  • Filename
    613639