DocumentCode :
3143603
Title :
Effects of lanthanum doping on the grain size and piezoelectric properties of lead titanate ceramics
Author :
Talwar, P. ; Tandon, R.P. ; Mansingh, Abhai
Author_Institution :
Dept. of Phys. & Astrophys., Delhi Univ., India
fYear :
1991
fDate :
33457
Firstpage :
105
Lastpage :
107
Abstract :
Modified lead titanate ceramics were prepared using mixed oxide route. A fixed amount of (1 mol%) iron (Fe) was added to get highly dense ceramics. Addition of 1 mol% tungsten (W) greatly enhanced the grain size. Lanthanum (La) concentration was changed from 2 to 25 mol%, keeping the concentration of Fe and W fixed at 1 mol%. The Curie temperature and tetragonality decreased with increasing La content. The dielectric constant showed a systematic increase with increasing La content. The piezoelectric coefficient were determined and it was found that the thickness coupling coefficient (kt) showed a marked increase with increasing La content reaching a peak value of 0.60 around 15 mol% while planar coupling coefficient (kp) was found to be almost independent of composition and having a value around 0.1. The hydrostatic figure of merit of about 1400 was achieved for 15 mol% of La which is one of the highest reported values even for hot pressed ceramics
Keywords :
crystal structure; ferroelectric Curie temperature; ferroelectric materials; grain size; iron compounds; lanthanum compounds; lead compounds; permittivity; piezoceramics; tungsten compounds; Curie temperature; PbTiO3:La,W,Fe; dielectric constant; grain size; highly dense ceramics; hot pressed ceramics; hydrostatic figure of merit; mixed oxide route; modified lead titanate ceramics; piezoelectric coefficient; piezoelectric properties; planar coupling coefficient; tetragonality; thickness coupling coefficient; Ceramics; Dielectric constant; Doping; Grain size; Iron; Lanthanum; Lead compounds; Temperature; Titanium compounds; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
Conference_Location :
University Park, PA
Print_ISBN :
0-7803-1847-1
Type :
conf
DOI :
10.1109/ISAF.1994.522309
Filename :
522309
Link To Document :
بازگشت