• DocumentCode
    3145216
  • Title

    MTJ based non-volatile flip-flop in deep submicron technology

  • Author

    Jung, Youngdon ; Kim, Jisu ; Ryu, Kyungho ; Jung, Seong-Ook ; Kim, Jung Pill ; Kang, Seung H.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
  • fYear
    2011
  • fDate
    17-18 Nov. 2011
  • Firstpage
    424
  • Lastpage
    427
  • Abstract
    The NVFF (Non-Volatile Flip-flop) using a MTJ is one of the powerful solutions for the low power system. However, the previous NVFF cannot provide a sufficient current to write the data into the MTJ in deep submicron technology. This problem occurs due to the lowered supply voltage (1.1V for core device in 45nm technology) with technology scaling. It can be resolved by increasing the supply voltage. However, the increased supply voltage causes a reliability problem of the core device. In order to overcome this problem, the proposed write circuit adopts an IO device with an IO supply voltage of 1.8V. In addition, the low-skewed NAND (LS-NAND) is used to efficiently interface the two supply voltage levels of 1.1V and 1.8V and to minimize the short circuit current in the write circuit. In this paper, the NVFF with the proposed write circuit is verified by HSPICE simulation using an industry compatible 45nm model parameter. The write current of the proposed write circuit is 60% greater than that of the previous write circuit and is sufficient for the proper write operation.
  • Keywords
    flip-flops; integrated circuit reliability; low-power electronics; MTJ based nonvolatile flip-flop; deep submicron technology; low power system; low-skewed NAND; reliability problem; technology scaling; MTJ; Non-volatile flip-flop; leakage current; write current;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoC Design Conference (ISOCC), 2011 International
  • Conference_Location
    Jeju
  • Print_ISBN
    978-1-4577-0709-4
  • Electronic_ISBN
    978-1-4577-0710-0
  • Type

    conf

  • DOI
    10.1109/ISOCC.2011.6138622
  • Filename
    6138622