• DocumentCode
    3145470
  • Title

    The customer lifetime value prediction in mobile telecommunications

  • Author

    Wang, Yi ; Sanguansintukul, Siripun ; Lursinsap, Chidchanok

  • Author_Institution
    Dept. of Math., Chulalongkorn Univ., Bangkok
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    565
  • Lastpage
    569
  • Abstract
    How to treat the customer relationship is a crucial problem in the telecommunications industry. Therefore, how to measure and manage customer lifetime value (CLV) for determining the likely future profit from the customer is very important because the customer is always looking for better and cheaper products and services. The CLV value not only combines with the churn management but also considers the cross-selling and up-selling to allure customer. Earning, not just buying, customerspsila loyalty is now mandatory. Analysis and prediction of customer lifetime value (CLV) methods by using Artificial neural network (ANN) is proposed here. In this paper Multi-Layer Perceptron (MLP) network with Levenberg-Marquardt algorithm is used to predict the CLV, the strategic and operational decisions to retain a customer Lifetime Value in the Mobile Telecommunications industry.
  • Keywords
    customer relationship management; mobile communication; multilayer perceptrons; telecommunication industry; Levenberg-Marquardt algorithm; artificial neural network; customer lifetime value; customer lifetime value prediction; customer relationship; mobile telecommunications industry; multi-layer perceptron; telecommunications industry; Artificial neural networks; Communication industry; Companies; Customer relationship management; Industrial relations; Mathematics; Mobile computing; Multilayer perceptrons; Profitability; Telecommunication computing; ANN; Artificial Neural Network; CLV; Customer lifetime value; MLP; Multi-Layer Perceptron;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Innovation and Technology, 2008. ICMIT 2008. 4th IEEE International Conference on
  • Conference_Location
    Bangkok
  • Print_ISBN
    978-1-4244-2329-3
  • Electronic_ISBN
    978-1-4244-2330-9
  • Type

    conf

  • DOI
    10.1109/ICMIT.2008.4654427
  • Filename
    4654427