• DocumentCode
    3145970
  • Title

    Microstructural effects on the electromechanical properties of PZT-BF ceramics

  • Author

    Huebner, W. ; Xue, W.R. ; Lu, P.W.

  • Author_Institution
    Dept. of Ceramic Eng., Missouri Univ., Rolla, MO, USA
  • fYear
    1991
  • fDate
    33457
  • Firstpage
    150
  • Lastpage
    153
  • Abstract
    In this study microstructure/property relationships were explored for piezoelectric ceramics with a composition of 0.97[(Pb0.95Sr0.05)(Zr0.514Ti0.484 )O3] -0.03BiFeO3. Very minor changes in the sintering temperature (1290-1310°C) or soak time (1.5-3.5 h) resulted in large differences in the electromechanical properties. Specifically, higher sintering temperatures resulted in no residual grain boundary phases, but larger grain sizes and/or variations in the defect structure resulted in lower permittivities, piezoelectric coefficients, and lower mechanical Q´s. The sintering time exhibited an optimal value; too short or too long resulted in poor performance. This study points clearly illustrates the difficulty in performing systematic compositional studies when the role of the microstructure can be dominant
  • Keywords
    bismuth compounds; crystal defects; crystal microstructure; ferroelectric materials; grain size; lead compounds; permittivity; piezoceramics; piezoelectricity; sintering; stoichiometry; 1.5 to 3.5 h; 1290 to 1310 C; Pb0.95Sr0.05Zr0.514Ti0.484O 3-BiFeO3; defect structure; electromechanical properties; grain size; mechanical Q´s; microstructure; permittivity; piezoelectric ceramics; sintering temperature; soak time; Ceramics; Dielectric constant; Dielectric losses; Dielectric measurements; Grain size; Impedance; Microstructure; Performance evaluation; Temperature; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
  • Conference_Location
    University Park, PA
  • Print_ISBN
    0-7803-1847-1
  • Type

    conf

  • DOI
    10.1109/ISAF.1994.522322
  • Filename
    522322