• DocumentCode
    3146176
  • Title

    Selecting research and development center partners for semiconductor industry in Taiwan

  • Author

    Hsieh, Chih-Hung

  • Author_Institution
    Ind. Technol. Res. Inst., Yuan Ze Univ., Jhongli
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    727
  • Lastpage
    733
  • Abstract
    Attracting multinational enterprises to set up research and development centers (RDCs) in domestic is a key strategy to upgrade industry ability for developing countries. In 2004, in order to strengthen its competitiveness of IC industry, Taiwan government decided to actively select multinational enterprise and pursuer them to setup RDCs in Taiwan. This paper describes the process of identifying required technologies and partners. Analysis by industry intelligence institute and survey of industry executives are employed in the process. The process used in the study is a top-down approach beginning from structure of the whole semiconductor industry, to required critical technologies, to possible RDC partners. Promotion and invitation programs are executed based on the result of the analysis. Taiwan government successfully pursuer some of the target partners and have them set up RDCs in Taiwan.
  • Keywords
    innovation management; integrated circuit manufacture; organisational aspects; semiconductor industry; IC industry; Taiwan; industry intelligence institute; invitation programs; multinational enterprises; research and development center partners; semiconductor industry; Costs; Electronics industry; Environmental economics; Investments; Local government; Productivity; Research and development; Technological innovation; Technology transfer; Throughput; Critical technology selection; Industrial cluster; Research & Development Centers (RDCs); Value chain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Innovation and Technology, 2008. ICMIT 2008. 4th IEEE International Conference on
  • Conference_Location
    Bangkok
  • Print_ISBN
    978-1-4244-2329-3
  • Electronic_ISBN
    978-1-4244-2330-9
  • Type

    conf

  • DOI
    10.1109/ICMIT.2008.4654455
  • Filename
    4654455