Title :
Thermal Aware Processor Operation Point Management
Author :
Gorti, Naga Pavan Kumar ; Somani, Arun K.
Abstract :
Existing schemes for dynamic voltage and frequency scaling (DVFS) do not account for the intertask thermal cycles. The chip reliability testing process usually also is not inclusive of test cases quantifying the chip reliability in the presence of small scale thermal cycles. However, a good number of in-field chip failures are attributed to the consequences of thermal cycles. Thus, it is imperative to include their effects into the processor voltage and frequency selection process. Our work focuses on developing an integrated processor thermal and performance management system centered on novel polynomial time scheduling algorithms that achieve minimal thermal cycle guarantees in soft real time environments. Our scheme leverages application awareness and runtime monitoring for improving the lifetime of the chip, while achieving considerable energy savings. Our scheme shows a significant reduction in thermal cycles and peaks, leading to longer chip life expectations. Our results indicate a 10 fold increase in the expected chip lifetime and 50% energy savings compared to operation at the rated maximum voltage and frequency.
Keywords :
integrated circuit reliability; integrated circuit testing; microprocessor chips; power aware computing; real-time systems; scheduling; DVFS; chip life expectations; chip lifetime; chip reliability testing process; dynamic voltage and frequency scaling; energy savings; frequency selection process; in-field chip failures; integrated processor thermal management; intertask thermal cycles; performance management system; polynomial time scheduling algorithms; processor voltage; run-time monitoring; small scale thermal cycles; soft real time environments; thermal aware processor operation point management; thermal cycle; thermal cycles reduction; Quality of service; Real-time systems; Reliability; Runtime; Schedules; Steady-state; Temperature; DVFS; Thermal cycles; chip reliability; soft real time systems; steady state temperature;
Conference_Titel :
Utility and Cloud Computing (UCC), 2012 IEEE Fifth International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4673-4432-6
DOI :
10.1109/UCC.2012.47