DocumentCode :
3147243
Title :
Effects of High Temperature Stress on Transgene Expression and DNA Methylation Pattern
Author :
Zeng, Fan-suo ; Xin, Ying ; Liu, Kun ; Zhan, Ya-guang ; Yang, Chuan-ping
Author_Institution :
Coll. of Life Sci., Northeast Forestry Univ., Harbin, China
fYear :
2010
fDate :
18-20 June 2010
Firstpage :
1
Lastpage :
4
Abstract :
Studies about the variation of DNA methylation pattern under high temperature stress (37°C) contribute to a comprehensive understanding of the apparent regulation of biological functions. Based on the in vitro cultivation of genetically modified birch (Betula platyphylla Suk.) clones for high-temperature stress, the paper detected exogenous gene transcription level differences with RT-PCR. Methylation-sensitive amplified polymorphism (MSAP) analysis the variation of DNA methylation pattern in transgenic birch. In this paper we used ten pairs of primers MSAP to deal with genetically modified DNA screening birch. The study revealed that high temperature stress can lead the level of transcriptional expression of transgene decrease, while endogenous levels of DNA methylation, including the overall methylation, the lateral semi-cytosine methylation as well as the inside of cytosine methylation level of the whole is almost twice than the control.
Keywords :
DNA; botany; cellular biophysics; genetic engineering; genetics; genomics; molecular biophysics; polymorphism; Betula platyphylla Suk; DNA methylation pattern; RT-PCR; biological functions; cytosine methylation level; exogenous gene transcription level; genetically modified birch clones; high temperature stress; in vitro cultivation; lateral semi-cytosine methylation; methylation-sensitive amplified polymorphism; transgene transcriptional expression; Biochemistry; Bioinformatics; Biological materials; DNA; Forestry; Gene expression; Genomics; Sequences; Stress control; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bioinformatics and Biomedical Engineering (iCBBE), 2010 4th International Conference on
Conference_Location :
Chengdu
ISSN :
2151-7614
Print_ISBN :
978-1-4244-4712-1
Electronic_ISBN :
2151-7614
Type :
conf
DOI :
10.1109/ICBBE.2010.5517794
Filename :
5517794
Link To Document :
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