DocumentCode :
3147932
Title :
Heterogeneous flip-chip assembly of a GaAs C-band power amplifier MMIC using liquid metal vertical interconnects
Author :
Ralston, P.E. ; Wood, Jo ; Vummidi, K. ; Oliver, J. Marcus ; Raman, S.
Author_Institution :
Virginia Tech, Blacksburg, United States
fYear :
2010
fDate :
23-28 May 2010
Firstpage :
1
Lastpage :
1
Abstract :
A new process utilizing room temperature liquid metals as interconnect material for flip chip assembly of active circuits has been demonstrated. These interconnects form flexible bonds between chips of heterogeneous materials and therefore flip clip assembly built with this configuration is not susceptible to thermomechanical stresses. A prefabricated GaAs MMIC chip is post processed to integrate liquid metal assembly structures. For the operation frequency of the MMIC between 4.9 – 8.5 GHz, average gain of the assembly is greater than 20 dB with an average transition loss of less than 1.8 dB.
Keywords :
Active circuits; Assembly; Flip chip; Gallium arsenide; Inorganic materials; Integrated circuit interconnections; MMICs; Power amplifiers; Temperature; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
ISSN :
0149-645X
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2010.5517832
Filename :
5517832
Link To Document :
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