DocumentCode :
3148989
Title :
Experimental study of ESD effect on metallic enclosure
Author :
Chan, K.H. ; Fung, L.C. ; Leung, S.W.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, China
fYear :
2002
fDate :
21-24 May 2002
Firstpage :
490
Lastpage :
492
Abstract :
Electrostatic Discharge (ESD) can cause serious problems in digital electronic devices. Indirect coupling through apertures on the metallic enclosure to the internal circuitries can also affect the performance of the devices. In this paper, we investigate experimentally the effect of the coupling field through apertures on the metallic enclosure.
Keywords :
electromagnetic coupling; electromagnetic shielding; electrostatic discharge; aperture; digital electronic device; electromagnetic shielding; electrostatic discharge; indirect coupling field; internal circuit; metallic enclosure; Apertures; Cable shielding; Cooling; Coupling circuits; Electrostatic discharge; IEC standards; Iron; Oscilloscopes; Protection; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2002 3rd International Symposium on
Print_ISBN :
0-7803-7277-8
Type :
conf
DOI :
10.1109/ELMAGC.2002.1177477
Filename :
1177477
Link To Document :
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