Intelligence study of control strategy in BGA rework process

As one branch of electronic components reuse techniques, research on BGA rework process is significant for ecology and economy. In this paper, one effective control project of heating temperature, reliability detecting of solder joints and automatic adjusting of BGA chip position is proposed, which extremely increases the degree of the artificial intelligence of BGA rework process with using the methods such as Fuzzy-PID theory, Blob analysis algorithm and SIFT feature points extraction and matching algorithm. Put the fuzzy self-tuning PID controller into use in the temperature control system of one electronic assembly equipment, which can achieve the real-time on-line correction of PID parameters and the temperature regulation result that is better than using the conventional PID controller especially in terms of the stability. The information of connected areas in BGA chip image provides basis for automatic reliability detecting of solder joints. SIFT algorithm is able to achieve the match between template image and target image without angle information, so that the precise angle to rotate becomes acquirable.