DocumentCode
3149544
Title
Measurement of in-shoe plantar triaxial stresses in high-heeled shoes
Author
Cong, Yan ; Zhang, Ming
Author_Institution
Dept. of Health Technol. & Inf., Hong Kong Polytech. Univ., Hong Kong, China
Volume
4
fYear
2010
fDate
16-18 Oct. 2010
Firstpage
1760
Lastpage
1763
Abstract
Foot problems such as pain and calluses are common for high-heeled shoe wearers. These problems may be related to the excessive local plantar loading, including pressure and shear stress. The shear stress is important on such a declined support surface of high-heeled shoe. The purpose of this study was to investigate the distribution of contact pressures and shear stresses simultaneously between plantar surface and high-heeled insole over specific regions utilizing in-shoe triaxial force transducers. The results showed that both the peak pressure and the peak shear stress occurred at the 2nd metatarsal head during walking and the average magnitudes of ten subjects were 386.9 kPa and 79.7 kPa respectively. The directions of anteroposterior and mediolateral shear stresses transferred from the posterior to anterior and from the lateral to medial respectively as the foot rolled forward from heel strike to toe off. The information on the distribution of plantar stresses may be useful for understanding of the foot biomechanics with high-heeled shoe and improvement of the high-heeled shoe design.
Keywords
biomechanics; biomedical measurement; bone; footwear; force measurement; mechanical contact; orthopaedics; 2nd metatarsal head; anteroposterior shear stress; calluses; contact pressures; declined support surface; foot biomechanics; heel strike; high-heeled insole; high-heeled shoe design; in-shoe plantar triaxial stress; in-shoe triaxial force transducer; local plantar loading; mediolateral shear stress; toe off; walking; Diabetes; Foot; Footwear; Force; Legged locomotion; Stress; Transducers; high-heeled shoes; shear stress; triaxial force transducer;
fLanguage
English
Publisher
ieee
Conference_Titel
Biomedical Engineering and Informatics (BMEI), 2010 3rd International Conference on
Conference_Location
Yantai
Print_ISBN
978-1-4244-6495-1
Type
conf
DOI
10.1109/BMEI.2010.5639873
Filename
5639873
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