• DocumentCode
    3150139
  • Title

    Dielectric and piezoelectric properties of ceramics in the lead indium niobate-lead scandium tantalate solid solution

  • Author

    Alberta, E.F. ; Bhalla, A.S.

  • Author_Institution
    Mater. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
  • fYear
    1991
  • fDate
    33457
  • Firstpage
    245
  • Lastpage
    248
  • Abstract
    The dielectric and piezoelectric properties of the solid solution: (x)·Pb(In1/2Nb1/2)O3-(1-x) Pb(Sc 1/2Ta1/2)O3 [PIN/PST(x)] have been investigated. The two compositions that have been studied are x=0.025 and 0.975. The degree of long range ordering in PIN/PST(92.5) was found to be 0.73 (i.e. 73% ordered.) Dielectric maximum was found to be at 10°C and the pyroelectric maximum was found to be at 0°C. The average dielectric constant from heating and cooling cycles was found to have a maximum of 1470, and corresponds to a dielectric loss of 3%. The maximum pyroelectric response was found to be 0.002 C/°K·m 2. At room temperature d33 and d31 were found to be 0 pC/N with poling fields of up to 45 kV/cm. Upon cooling to -30°C a ferroelectric hysteresis loop appears with Ec=9.86 kV/cm and Pr=4.5 mC/cm2
  • Keywords
    dielectric hysteresis; dielectric losses; dielectric polarisation; ferroelectric materials; lead compounds; long-range order; permittivity; piezoceramics; piezoelectric materials; pyroelectricity; -30 degC; 0 degC; 10 degC; Pb(In12/Nb12/)O3-Pb(Sc12/Ta 12/)O3; PbInO3NbO3-PbScO3TaO3; average dielectric constant; ceramics; dielectric loss; dielectric maximum; dielectric properties; ferroelectric hysteresis loop; long range ordering; piezoelectric properties; poling fields; pyroelectric maximum; pyroelectric response; room temperature; solid solution; Ceramics; Cooling; Dielectric constant; Dielectric losses; Heating; Lead; Niobium; Pyroelectricity; Solids; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
  • Conference_Location
    University Park, PA
  • Print_ISBN
    0-7803-1847-1
  • Type

    conf

  • DOI
    10.1109/ISAF.1994.522349
  • Filename
    522349