• DocumentCode
    3151447
  • Title

    3-3 composite hydrophones from distorted reticulated ceramics

  • Author

    Creedon, M.J. ; Gopalakrishnan, S. ; Schulze, W.A.

  • Author_Institution
    New York State Coll. of Ceramics, Alfred Univ., NY, USA
  • fYear
    1991
  • fDate
    33457
  • Firstpage
    299
  • Lastpage
    302
  • Abstract
    Application of reticulated ceramic technology to the fabrication of 3-3 lead zirconate-titanate (PZT)/epoxy composite hydrophones has been investigated. Directional distortion of the ceramic structure to enhance the composite hydrostatic response has also been studied. Composite fabrication is described and the effects of polymer type, distortion, volume percent PZT and poling field on the hydrophone properties are presented. In general, the results indicate that reticulated ceramic composites (RCCs) have properties which are comparable to other 3-3 PZT/epoxy composites. Composites which contained the stiffer Spurr epoxy significantly out performed those containing a softer Eccogel epoxy. In addition, a distorted structure and higher density improved hydrophone response. The novel use of reticulated ceramic technology provides substantial improvement in manufacturability over other methods and allows fabrication of sensitive, low density hydrophones
  • Keywords
    dielectric polarisation; filled polymers; hydrophones; lead compounds; materials preparation; piezoceramics; 3-3 composite hydrophones; Eccogel epoxy; PZT; PZT/epoxy composite hydrophones; PbZrO3TiO3; Spurr epoxy; composite hydrostatic response; density; directional distortion; distorted reticulated ceramics; distortion; fabrication; manufacturability; poling field; polymer type; reticulated ceramic technology; volume percent; Ceramics; Dielectric constant; Dielectric materials; Fabrication; Large-scale systems; Polymers; Sensor arrays; Sonar equipment; Stress; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
  • Conference_Location
    University Park, PA
  • Print_ISBN
    0-7803-1847-1
  • Type

    conf

  • DOI
    10.1109/ISAF.1994.522363
  • Filename
    522363