Influence of various gas inclusion in Ar thermal ICP at atmospheric pressure upon plasma temperature and impedance

Author

Tanaka, Y. ; Uchiyama, H. ; Sakuta, T.

Author_Institution

Dept. of Electr. & Electron. Eng., Kanazawa Univ., Japan

Volume

2

fYear

2002

fDate

6-10 Oct. 2002

Firstpage

898

Abstract

The influence of various gas inclusions upon thermal plasma was investigated from the viewpoint of finding alternatives to SF₆ as an arc-quenching medium in a high voltage circuit breaker. The inductively coupled thermal plasma (ICTP) technique was used to sustain thermal plasma. The effect of SF₆ and six environmental-benign gas inclusions on plasma temperature and impedance was measured. The result indicated that SF₆ causes the plasma radius reduction and plasma temperature decline only with a several percentage inclusion. The similar tendency was found for CO₂, while it was not found for the other five gases. This indicates that CO₂ has a higher plasma-quenching property than the others in the experiment.

Keywords

circuit breakers; circuit-breaking arcs; plasma diagnostics; plasma temperature; switchgear testing; CO₂; SF₆; arc-quenching medium; gas inclusions; high voltage circuit breaker; inductively coupled thermal plasma technique; plasma impedance; plasma radius reduction; plasma temperature; plasma temperature decline; plasma-quenching property; thermal plasma; Argon; Atmospheric-pressure plasmas; Circuit breakers; Coupling circuits; Gases; Impedance measurement; Plasma measurements; Plasma properties; Plasma temperature; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Transmission and Distribution Conference and Exhibition 2002: Asia Pacific. IEEE/PES

Print_ISBN

0-7803-7525-4

Type

conf

DOI

10.1109/TDC.2002.1177595

Filename

1177595