A study of mechanical properties of multi-layered thin films [for MEMS]

Author

Hirasawa, T. ; Kotera, H. ; Tawa, S. ; Shima, S.

Author_Institution

Dept. of Mech. Eng., Kyoto Univ., Japan

Volume

1

fYear

1999

fDate

36342

Firstpage

221

Abstract

It is of great importance to investigate mechanical properties of a multi-layered thin film in designing and realizing micro-electro-mechanical systems (MEMS). A new tensile test method is proposed to measure mechanical properties of a multi-layered thin film, which are used in MEMS. In this method, we develop a prefabricated test substrate of gage portion. After measuring Young´s modulus of prefabricated test substrate, a thin film is deposited on the test substrate and tensile test is carried out. Young´s modulus of the thin film can be measured by subtracting the effect of Young´s modulus of the prefabricated test substrate. As an example, Young´s modulus of a tungsten thin film deposited by sputtering is measured. We discuss the viability of this method for measuring the mechanical properties of deposited thin film

Keywords

Young´s modulus; elastic moduli measurement; metallic thin films; micromechanical devices; multilayers; sputtered coatings; tensile testing; tungsten; MEMS design; W; Young´s modulus; gage portion; mechanical properties; multilayered thin films; prefabricated test substrate; sputtered film; surface micromachining; tensile test method; Mechanical factors; Mechanical variables measurement; Microelectromechanical systems; Micromechanical devices; Piezoelectric films; Silicon; Sputtering; Substrates; Testing; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Intelligent Processing and Manufacturing of Materials, 1999. IPMM '99. Proceedings of the Second International Conference on

Conference_Location

Honolulu, HI

Print_ISBN

0-7803-5489-3

Type

conf

DOI

10.1109/IPMM.1999.792477

Filename

792477