Extracting Resistances of Carbon Nanostructures in Vias

Author

Wu, Wen ; Krishnan, Shoba ; Li, Ke ; Sun, Xuhui ; Wu, Raymond ; Yamada, Toshishige ; Yang, Cary Y.

Author_Institution

Center for Nanostruct., Santa Clara Univ., Santa Clara, CA

fYear

2009

fDate

March 30 2009-April 2 2009

Firstpage

27

Lastpage

30

Abstract

This paper describes a current-sensing technique to extract the resistances of carbon nanostructures in via interconnects. Test structures designed and fabricated for via applications contain carbon nanofiber (CNF)-metal composites embedded in silicon dioxide (SiO₂). Electrical characterization of single CNFs is performed using an atomic force microscope (AFM). This technique yields a metal-CNF contact resistance of 6.4 kOmega and a lowest CNF resistivity of 1.89e-4 Omega-cm.

Keywords

atomic force microscopy; carbon; contact resistance; integrated circuit interconnections; nanofibres; C-SiO₂; atomic force microscope; carbon nanofiber-metal composites; carbon nanostructures; current-sen technique; electrical resistivity; metal-CNF contact resistance; silicon dioxide; via interconnects; Atomic force microscopy; Contact resistance; Electric resistance; Electric variables; Electrical resistance measurement; Electrodes; Nanostructures; Nickel; Scanning electron microscopy; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 2009. ICMTS 2009. IEEE International Conference on

Conference_Location

Oxnard, CA

Print_ISBN

978-1-4244-4259-1

Type

conf

DOI

10.1109/ICMTS.2009.4814603

Filename

4814603