• DocumentCode
    3152698
  • Title

    Packaging of microstrip circuits using bed of springs to suppress cavity modes - A replacement for bed of nails

  • Author

    Rajo-Iglesias, E. ; Kilda, P.S. ; Kishk, A.

  • Author_Institution
    Dept. Signal Theor. & Comm., Univ. Carlos III de Madrid, Leganes, Spain
  • fYear
    2010
  • fDate
    23-28 May 2010
  • Firstpage
    405
  • Lastpage
    408
  • Abstract
    The bed of nails has been demonstrated to be very useful in the design of new confined gap waveguide appearing between parallel metal plates with texture, as well as for removing cavity modes in microstrip circuit packages. As the bed of nails is bulky at low frequencies due to the required height of the nails, a new version of this periodic structure is proposed herein, based on helices instead of nails. Thus, the bed of nails is replaced by a bed of springs. The bed of springs is much more compact for use at low frequencies, and its bandwidth turns out to be similar. Thus, the new spring mattress approach is more comfortable than the Fakirs bed of nails at low frequencies.
  • Keywords
    electronics packaging; microstrip circuits; waveguides; bed of springs; cavity modes; confined gap waveguide; microstrip circuits; packaging; parallel metal plates; spring mattress approach; Bandwidth; Circuits; Conductors; Frequency; Microstrip; Nails; Packaging; Periodic structures; Springs; Waveguide discontinuities; AMC; Parallel plate mode; gap waveguide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
  • Conference_Location
    Anaheim, CA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-6056-4
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2010.5518068
  • Filename
    5518068