DocumentCode
315291
Title
Manufacturing integration of data collection and statistical process control systems
Author
Clayton, Mike ; Durham, Jim ; Felker, Steve ; Fortner, Gene ; Martinez, Jim ; Shelton, Steve
Author_Institution
Motorola Inc., Mesa, AZ, USA
fYear
1997
fDate
9-12 Sep 1997
Firstpage
505
Lastpage
507
Abstract
Internal microprocessors are used in modern etchers to control wafer handling, lot and wafer logistics, processing, process control, and maintenance functions. In addition, external systems have been developed to provide additional monitoring and control capabilities. This paper addresses the automation of an etch area that includes polysilicon, oxide, and metal etching. Software packages that will be discussed are: 1) a family of diagnostic and planned maintenance (PM) tools that interface with the etchers and perform real time statistical process control, 2) the cell controller which is used to download recipes and recipe information to the etchers, and 3) network integration software. Solutions to networking and integration challenges were critical to the successful implementation. A description of the software tools and the integration into the manufacturing environment is presented. Techniques for problem identification and troubleshooting, and prevention are also discussed
Keywords
etching; integrated circuit manufacture; local area networks; maintenance engineering; software packages; statistical process control; SPC; data collection; diagnostic tools; etchers; internal microprocessors; logistics; maintenance functions; manufacturing integration; metal etching; network integration software; planned maintenance tools; polysilicon; real-time statistical process control; software packages; wafer handling; Automatic control; Control systems; Etching; Logistics; Manufacturing automation; Microprocessors; Monitoring; Process control; Software packages; Software tools;
fLanguage
English
Publisher
ieee
Conference_Titel
Emerging Technologies and Factory Automation Proceedings, 1997. ETFA '97., 1997 6th International Conference on
Conference_Location
Los Angeles, CA
Print_ISBN
0-7803-4192-9
Type
conf
DOI
10.1109/ETFA.1997.616322
Filename
616322
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