Nanomechanical test structure for optimal alignment in stencil-based lithography

Author

Sansa, Marc ; Arcamone, Julien ; Verd, Jaume ; Uranga, Arantxa ; Abada, Gabriel ; Lora-Tamayo, Emilio ; Barniol, Nuria ; Van den Boogaart, Marc A F ; Savu, Veronica ; Brugger, Juergen ; Perez-Murano, Francesc

Author_Institution

Inst. de Microelectron. de Barcelona CNM-IMB (CSIC), Barcelona

fYear

2009

fDate

March 30 2009-April 2 2009

Firstpage

157

Lastpage

161

Abstract

A nanoelectromechanical mass sensor based on a submicron size resonating metallic beam is used to characterize material deposition rates in stencil lithography. The material flux through micron size apertures is mapped with high spatial (below 1 mum) and deposition rate (below 10 pm/s) resolutions by displacing stencil apertures above the sensor. It is discussed how the sensor can be used as a test alignment for multi-level nanostencil lithography.

Keywords

beams (structures); micromechanical resonators; nanolithography; nanosensors; nanostructured materials; material deposition characterization; multilevel nanostencil lithography; nanoelectromechanical mass sensor; nanomechanical test structure; optimal alignment; stencil-based lithography; submicron size resonating metallic beam; Apertures; Circuit testing; Lithography; Mechanical sensors; Nanostructures; Resonance; Sensor phenomena and characterization; Spatial resolution; Stereolithography; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 2009. ICMTS 2009. IEEE International Conference on

Conference_Location

Oxnard, CA

Print_ISBN

978-1-4244-4259-1

Type

conf

DOI

10.1109/ICMTS.2009.4814631

Filename

4814631