• DocumentCode
    315355
  • Title

    The temperature effect of degradation in tunneling and conventional silicon dioxides

  • Author

    Kim, Hyeon-Seag ; Campbell, S.A. ; Lee, Kyung-Ho ; Kim, Dong Myong ; Seo, Kwang-Yell

  • Author_Institution
    Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
  • Volume
    2
  • fYear
    1997
  • fDate
    25 -30 May 1997
  • Firstpage
    722
  • Abstract
    The charge to breakdown (QBD) was studied as functions of both temperature and current injection level under stress for tunnel anneal (40 Å) and conventional (103 Å) silicon dioxide (SiO 2) in the metal-oxide-semiconductor (MOS) system. The charge to breakdown is almost independent of current injection level at higher temperatures for 103 Å SiO2 films although the QBD of 40 Å SiO2 films strongly depends both on current level and on temperature. Higher activation energies were obtained for 40 Å oxides at lower temperatures (25°C-100°C), while larger activation energy was obtained for 103 Å oxides at higher temperatures (150°C-200°C)
  • Keywords
    MIS devices; MIS structures; annealing; dielectric thin films; electric breakdown; silicon compounds; tunnelling; 25 to 200 C; SiO2; activation energy; charge to breakdown; current injection; degradation; metal-oxide-semiconductor system; silicon dioxide film; temperature effect; tunnel anneal; Annealing; Degradation; Design for quality; Electric breakdown; Electrons; Semiconductor films; Silicon compounds; Stress; Temperature dependence; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    0-7803-2651-2
  • Type

    conf

  • DOI
    10.1109/ICPADM.1997.616537
  • Filename
    616537