DocumentCode
315355
Title
The temperature effect of degradation in tunneling and conventional silicon dioxides
Author
Kim, Hyeon-Seag ; Campbell, S.A. ; Lee, Kyung-Ho ; Kim, Dong Myong ; Seo, Kwang-Yell
Author_Institution
Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
Volume
2
fYear
1997
fDate
25 -30 May 1997
Firstpage
722
Abstract
The charge to breakdown (QBD) was studied as functions of both temperature and current injection level under stress for tunnel anneal (40 Å) and conventional (103 Å) silicon dioxide (SiO 2) in the metal-oxide-semiconductor (MOS) system. The charge to breakdown is almost independent of current injection level at higher temperatures for 103 Å SiO2 films although the QBD of 40 Å SiO2 films strongly depends both on current level and on temperature. Higher activation energies were obtained for 40 Å oxides at lower temperatures (25°C-100°C), while larger activation energy was obtained for 103 Å oxides at higher temperatures (150°C-200°C)
Keywords
MIS devices; MIS structures; annealing; dielectric thin films; electric breakdown; silicon compounds; tunnelling; 25 to 200 C; SiO2; activation energy; charge to breakdown; current injection; degradation; metal-oxide-semiconductor system; silicon dioxide film; temperature effect; tunnel anneal; Annealing; Degradation; Design for quality; Electric breakdown; Electrons; Semiconductor films; Silicon compounds; Stress; Temperature dependence; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
Conference_Location
Seoul
Print_ISBN
0-7803-2651-2
Type
conf
DOI
10.1109/ICPADM.1997.616537
Filename
616537
Link To Document