DocumentCode
315360
Title
Arc-resistant properties of PTFE composites
Author
Park, Hoy-Yul ; Kang, Dong-Pil ; Han, Dong-Hee ; Ahn, Myeong-Sang
Author_Institution
Div. of Electr. Mater., Korea Electrotechnol. Res. Inst., Changwon, South Korea
Volume
2
fYear
1997
fDate
25 -30 May 1997
Firstpage
859
Abstract
PTFE (polytetrafluoroethylene) has been used as material for breaker nozzle that has very high light reflectance, thermal and chemical stability, good electrical resistance and low loss factor. Though PTFE is better than any other polymer, it cannot be used for a long time in the high temperature arc environment. So, inorganic materials are used as filler in PTFE to improve the endurance in such environments of high voltage and current. It is necessary to compound PTFE with inorganic fillers because the pure PTFE used for high voltage and current breaker nozzle suffers inner explosion as well as surface degradation. The arc resistance of PTFE composites was increased with increasing filler content. But those values were different for different kinds of fillers and their content. The arc resistance of BN filled PTFE composites was better than that of Al2O3 or TiO 2 filled PTFE composites. The most important factor of fillers seems to be the light reflectance of the ultraviolet light
Keywords
circuit breakers; circuit-breaking arcs; dielectric losses; filled polymers; insulation testing; life testing; particle reinforced composites; polyethylene insulation; Al2O3; BN; PTFE composites; TiO2; arc resistance; breaker nozzle; chemical stability; electrical resistance; endurance; filled polymers; high temperature arc environment; light reflectance; loss factor; polytetrafluoroethylene; surface degradation; thermal stability; ultraviolet light; Chemicals; Electric resistance; Inorganic materials; Polymers; Reflectivity; Temperature; Thermal factors; Thermal resistance; Thermal stability; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
Conference_Location
Seoul
Print_ISBN
0-7803-2651-2
Type
conf
DOI
10.1109/ICPADM.1997.616572
Filename
616572
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