Title :
Inductive coupling transceivers for inter-chip data communication
Author :
Kuroda, Tadahiro
Author_Institution :
Keio Univ., Yokohama, Japan
fDate :
Jan. 9 2009-Dec. 11 2009
Abstract :
ThruChip Interface (TCI) employing inductive coupling bares comparison with TSV in performance with much inexpensive cost. It is available for production. For instance, Solid-State Drive (SSD) in a package can be realized by stacking NAND Flash memories. A high-speed low-power DRAM interface can be implemented. Extension of communication distance to millimeter ranges makes it possible to probe internal bus data through package for debugging and to perform non-contact wafer simultaneous testing. Wireless power delivery by using inductive coupling will further widen the applications. In this paper technology and applications of the TCI are presented.
Keywords :
data communication; radiofrequency identification; three-dimensional integrated circuits; transceivers; inductive coupling transceivers; inter-chip data communication; thruchip interface; Costs; Data communication; Packaging; Probes; Production; Random access memory; Solid state circuits; Stacking; Through-silicon vias; Transceivers;
Conference_Titel :
Radio-Frequency Integration Technology, 2009. RFIT 2009. IEEE International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5031-2
Electronic_ISBN :
978-1-4244-5032-9
DOI :
10.1109/RFIT.2009.5383655
