• DocumentCode
    3154207
  • Title

    Special Interest Group (SIG): Fast Wafer Level Reliability (fWLR) Monitoring

  • Author

    Martin, Andrew

  • Author_Institution
    Infineon Technol. AG, Munich
  • fYear
    2007
  • fDate
    15-18 Oct. 2007
  • Firstpage
    159
  • Lastpage
    160
  • Abstract
    With the perspective of detecting, minimising or eliminating reliability fails of products due to processing problems after process qualification it becomes evident to establish fWLR Monitoring on product wafers. Clearly a complete testplan which covers all reliability items is necessary. Therefore, the systematic set up of fWLR should be standardised and described in a document for the semiconductor manufacturing and semiconductor vendor community worldwide. This SIG was initiated to start with a brainstorming on this topic and the ultimate goal would be to introduce a JEDEC guideline on fWLR. The brain storming results are summarised.
  • Keywords
    integrated circuit reliability; integrated circuit testing; process monitoring; semiconductor technology; standards; fast wafer level reliability monitoring; process qualification; processing problem; product reliability failure; product wafer; semiconductor manufacturing; semiconductor vendor community; special interest group;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2007. IRW 2007. IEEE International
  • Conference_Location
    S. Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4244-1771-9
  • Type

    conf

  • DOI
    10.1109/IRWS.2007.4469246
  • Filename
    4469246