Title :
Special Interest Group (SIG): Fast Wafer Level Reliability (fWLR) Monitoring
Author_Institution :
Infineon Technol. AG, Munich
Abstract :
With the perspective of detecting, minimising or eliminating reliability fails of products due to processing problems after process qualification it becomes evident to establish fWLR Monitoring on product wafers. Clearly a complete testplan which covers all reliability items is necessary. Therefore, the systematic set up of fWLR should be standardised and described in a document for the semiconductor manufacturing and semiconductor vendor community worldwide. This SIG was initiated to start with a brainstorming on this topic and the ultimate goal would be to introduce a JEDEC guideline on fWLR. The brain storming results are summarised.
Keywords :
integrated circuit reliability; integrated circuit testing; process monitoring; semiconductor technology; standards; fast wafer level reliability monitoring; process qualification; processing problem; product reliability failure; product wafer; semiconductor manufacturing; semiconductor vendor community; special interest group;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2007. IRW 2007. IEEE International
Conference_Location :
S. Lake Tahoe, CA
Print_ISBN :
978-1-4244-1771-9
DOI :
10.1109/IRWS.2007.4469246