DocumentCode
3154207
Title
Special Interest Group (SIG): Fast Wafer Level Reliability (fWLR) Monitoring
Author
Martin, Andrew
Author_Institution
Infineon Technol. AG, Munich
fYear
2007
fDate
15-18 Oct. 2007
Firstpage
159
Lastpage
160
Abstract
With the perspective of detecting, minimising or eliminating reliability fails of products due to processing problems after process qualification it becomes evident to establish fWLR Monitoring on product wafers. Clearly a complete testplan which covers all reliability items is necessary. Therefore, the systematic set up of fWLR should be standardised and described in a document for the semiconductor manufacturing and semiconductor vendor community worldwide. This SIG was initiated to start with a brainstorming on this topic and the ultimate goal would be to introduce a JEDEC guideline on fWLR. The brain storming results are summarised.
Keywords
integrated circuit reliability; integrated circuit testing; process monitoring; semiconductor technology; standards; fast wafer level reliability monitoring; process qualification; processing problem; product reliability failure; product wafer; semiconductor manufacturing; semiconductor vendor community; special interest group;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2007. IRW 2007. IEEE International
Conference_Location
S. Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-1771-9
Type
conf
DOI
10.1109/IRWS.2007.4469246
Filename
4469246
Link To Document