DocumentCode

315441

Title

The Strategy And Status Of A Bare Chip Packaging

Author

Tsukada, Yutaka

fYear

1997

fDate

16-18 April 1997

Firstpage

5

Lastpage

9

Keywords

Bonding; Ceramics; Conducting materials; Conductors; Copper; Costs; Flip chip; Printed circuits; Semiconductor device packaging; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

618967