DocumentCode :
315441
Title :
The Strategy And Status Of A Bare Chip Packaging
Author :
Tsukada, Yutaka
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
5
Lastpage :
9
Keywords :
Bonding; Ceramics; Conducting materials; Conductors; Copper; Costs; Flip chip; Printed circuits; Semiconductor device packaging; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618967
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315441
